Competence for your chips:
With the Chip-on-Board technology, bare semiconductor chips, whether they be mounted directly on circuit boards or hybrid circuits, are mounted for electronic devices - usually in combination with SMD assembly. The COB technology consists of the processes of chip bonding, wire bonding and chip encapsulation. Within these processes, a number of different processes is used, which compete with each other and result from the specific requirements of the application.
Chip bonding can be effected on the basis of conductive or non conductive adhesive or eutectic bonding. In wire bonding, different methods and wire materials (gold, aluminium and others) and different wire sizes are used. For the contacts of power semiconductors, thick wire bonding (100 to 300 micron wire) is used. The chip encapsulation is performed by means of needle dispensing process or by jet-dispensing process. These processes are subject to continuous development with respect to miniaturization and integration density – contact pad dimensions have to be continuously reduced, the wire diameter further reduced and geometric precision has to be increased.
Another form of the chip assembly is the flip-chip technology: Here the chip is directly applied with glue or solder balls connected to the wiring substrate.